أمكور تكنولوجي Amkor Technology

(تم التحويل من Amkor Technology)
Amkor Technology, Inc.
النوعPublic
رمز التداول
ISIN[https://isin.toolforge.org/?language=en&isin=US0316521006 US0316521006]
الصناعةSemiconductors & Related Devices
تأسست1968; 57 years ago (1968
المؤسسHyang-Soo Kim
المقر الرئيسيTempe, Arizona, U.S.
عدد المواقع
12
الأشخاص الرئيسيون
(corporate VP & CFO)
الدخلDecrease US$6٫50 billion (2023)
ربح العملياتDecrease US$470 million (2023)
Decrease US$362 million (2023)
إجمالي الأصولDecrease US$6.77 billion (2023)
إجمالي الأنصبة▲ US$3.96 billion (2023)
الموظفون28,700 (2023)
الموقع الإلكترونيamkor.com
Footnotes / references
[3][4]

Amkor Technology, Inc. is a semiconductor product packaging and test services provider. The company has been headquartered in Arizona, since 2005, when it was moved from West Chester, Pennsylvania, also in the United States.[5] The company's Arizona headquarters was originally in Chandler,[6] then later moved to Tempe. The company was founded in 1968 and, اعتبارا من 2022, has approximately 31,000 employees worldwide and a reported $7.1 billion in sales.

With factories in China, Japan, Korea, Malaysia, Philippines, Portugal, Taiwan and Vietnam, Amkor is a major player in the semiconductor industry. It designs, packages and tests integrated circuits (ICs) for chip manufacturers.

Etymology

Amkor self-publishes that the name "Amkor" is a portmanteau of the words "America" and "Korea".[7]

History

Amkor's origins can be traced back to ANAM Industries, a business in Seoul dealing with imported Japanese goods, including bicycles, and founded by Hyang-Soo Kim in 1935. In March 1968, ANAM Industries underwent a transformation into ANAM Industrial Co. Ltd., becoming South Korea's first semiconductor business. One month later, his son Joo-Jin (James) Kim founded Amkor Electronics, Inc. and inaugurated its sales office in Philadelphia. Its semiconductor production and export began in 1970. In 1998, Amkor began publicly trading on Nasdaq.[7]

In 2000, Amkor acquired Integra Technologies, an Outsourced Semiconductor Assembly And Test (OSAT) provider in United States.[8] In 2005, Amkor spun off Integra Technologies.[9]

In February 2016, Amkor fully acquired J-Devices Corp, the largest Outsourced Semiconductor Assembly And Test (OSAT) provider in Japan.[10][11]

In June 2017, Amkor Technology was recognized as Supplier of the Year for 2016 by Qualcomm Technologies for a second consecutive year.[12]

Amkor Technology has competitiveness for chip assembly by thermal compression as well as wafer level packaging. In September 2018, Amkor Technology opened a manufacturing and test plant at Longtan Science Park in Taiwan.[13]

In 2019, Amkor Technology was ranked 2nd in overall revenue in the OSAT (Outsourced Semiconductor Assembly and Test) market.

A $2 billion factory for advanced packaging of chips from TSMC in Arizona was announced in November 2023.[14]

Products

Amkors designs, packages and tests semiconductors for other companies. The company's offers include RF-antenna designs incorporated directly into or onto a chip,[15] CMOS imaging sensors[16] or flip chip packaging with copper pillars bumps.[17][18] Amkor also offers wire bonding of semiconductors to packages[19] as well as a technology to prevent edge gaps and cracks on semiconductor packaging called "Edge Protection".[20][21]

See also

المراجع

  1. ^ "Giel Rutten".
  2. ^ Jeff Gifford (June 18, 2020). "Valley semiconductor company names new CEO". Phoenix Business Journal.
  3. ^ "Amkor Technology – Company History" (in الإنجليزية). Retrieved 2018-01-08.
  4. ^ "US SEC: Form 10-K 2013". U.S. Securities and Exchange Commission. February 16, 2024. Retrieved February 17, 2024.
  5. ^ "Amkor's outlook improved as it moves headquarters". EETimes.
  6. ^ "Amkor relocates to Arizona - Philadelphia Business Journal". 2023-12-05. Archived from the original on 2023-12-05. Retrieved 2023-12-05.
  7. ^ أ ب "Company History". Amkor Technology. Retrieved January 27, 2024.
  8. ^ "2000 Annual Report". Amkor Technology. 2001. Archived from the original on February 9, 2023.
  9. ^ "Amkor spin-off Integra focuses on test". EE Times. October 10, 2005. Archived from the original on February 9, 2023.
  10. ^ "Amkor Tech finishes 100 percent buy of a Japanese semiconductor company". bizjournals.com. February 11, 2016. Retrieved 2025-05-09.
  11. ^ "Amkor Completes Semiconductor Packaging Firm Nanium's Buyout". nasdaq.com. May 24, 2017.
  12. ^ "Amkor Technology Recognized as Supplier of the Year for Second Consecutive Year by Qualcomm". Bloomberg.com. 15 June 2017. Archived from the original on 2020-03-17. Retrieved 2020-03-17.
  13. ^ "Amkor opens new semiconductor package manufacturing and test plant in Taiwan | Solid State Technology". electroiq.com (in الإنجليزية الأمريكية). Retrieved 2018-09-25.
  14. ^ "Amkor to build $2 billion Arizona semiconductor packaging plant". reuters.com. 2023-11-30. Retrieved 2023-12-20.
  15. ^ "FAQ: Antenna-in-package answers the "last mile" RF challenge, Part 2". 5gtechnologyworld.com. 2023-06-06. Retrieved 2024-10-23.
  16. ^ "Amkor claims 13% of outsourced CMOS image sensor packaging". eetimes.com. 2002-11-05. Retrieved 2024-10-23.
  17. ^ "Amkor Technology and Texas Instruments Deliver Industry's First Fine Pitch Copper Pillar Flip Chip Packages to Market". techonline.com. Retrieved 2024-10-23.
  18. ^ "Amkor looks to EU CHIPS Act for semiconductor packaging in Portugal". eenewseurope.com. 2022-10-25. Retrieved 2024-10-23.
  19. ^ "Wirebonding Is Here To Stay". semiengineering.com. 2023-10-19. Retrieved 2024-10-23.
  20. ^ "Enhancing Punch MLF Packaging with Edge Protection Technology". semiengineering.com. 2023-06-14. Retrieved 2024-10-23.
  21. ^ "Amkor's Edge Protection™ Technology" (PDF). semiconductorpackagingnews.com. Retrieved 2024-10-23.

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